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rev. 1.1 june 2011 www.aosmd.com page 1 of 16 AOZ1341 dual channel usb switch general description the AOZ1341 is a member of alpha and omega semiconductor?s dual channel power distribution switch family intended for applications where heavy capacitive loads and short-circuits are li kely to be encountered. this device incorporates 70 m ? n-channel mosfet power switches for power-distribution systems that require multiple power switches in a single package. each switch is controlled by a logic enable input. gate drive is provided by an internal charge pump designed to control the power-switch rise times and fall times to minimize current surges during switching. the charge pump requires no external components and allows operation from supplies as low as 2.7 v. the AOZ1341 is available in an exposed pad msop-8 or an so8 8-pin package and is rated over the -40 c to +85 c ambient temperature range. features z typical 70 m (nfet) z 1 a maximum continuous current z v in range: 2.7 v to 5.5 v z open drain fault flag z fault flag deglitched (blanking time) z discharge switch for shutdown z thermal shutdown z reverse current blocking z packages: exposed pad msop-8 and so-8 applications z notebook computers z desktop computers typical application AOZ1341 in oc1 en2/en2 oc2 en1/en1 out1 out2 gnd v in c4 0.1 f c2 22 f c3 0.1 f cx r1 10k r2 10k c1 22 f load load
AOZ1341 rev. 1.1 june 2011 www.aosmd.com page 2 of 16 ordering information aos green products use reduced levels of halogens, and are also rohs compliant. please visit www.aosmd.com/web/qualit y/rohs_compliant.jsp for additional information. pin configuration pin description part number maximum continuous current typical short-circuit current limit enable setting package environmental AOZ1341ai 1 a 1.5 a active low so-8 green product rohs compliant AOZ1341ai-1 active high AOZ1341ei active low exposed pad msop-8 AOZ1341ei-1 active high pin name pin number pin function gnd 1 ground in 2 input voltage en1/en1 3 enable input, logic high/logic low turns on power switch in-out1 en2/en2 4 enable input, logic high/logic low turns on power switch in-out2 oc2 5 overcurrent, open-drain outpu t, active low, in-out2 out2 6 power-switch output, in-out2 out1 7 power-switch output, in-out1 oc1 8 overcurrent, open-drain outpu t, active low, in-out1 oc1 out1 out2 oc2 1 2 3 4 gnd in en1/en1 en2/en2 pad exposed pad msop-8 (top view) 8 7 6 5 oc1 out1 out2 oc2 1 2 3 4 gnd in en1/en1 en2/en2 so-8 (top view) 8 7 6 5
AOZ1341 rev. 1.1 june 2011 www.aosmd.com page 3 of 16 absolute maximum ratings exceeding the absolute maximum ratings may damage the device. note: 1. devices are inherently esd s ensitive, handling precautions are required. human body model is a 100 pf capacitor discharging through a 1.5 k resistor. recommended operating conditions the device is not guaranteed to operate beyond the recommended operating conditions. parameter rating input voltage (v in )6 v enable voltage (v en )6 v storage temperature (t s ) -55 c to +150 c maximum continuous current 1 a esd rating (1) 2 kv parameter rating input voltage (v in ) +2.7 v to +5.5 v junction temperature (t j ) -40 c to +125 c package thermal resistance exposed pad msop-8 ( ja ) so-8 ( ja ) 60 c/w 115 c/w electrical characteristics t a = 25 c, v in = 5.5 v, v en = 0 v, unless otherwise specified. symbol parameter conditions (3) min. typ. max. units power switch r ds(on) switch on-resistance v in = 5.5 v, i o = 1 a 70 135 m t r rise time, output v in = 5.5 v c l = 1 f, r l = 5 0.6 1.5 ms v in = 2.7 v 0.4 1 t f fall time, output v in = 5.5 v 0.05 0.5 ms v in = 2.7 v 0.05 0.5 fet leakage current out connect to ground, 2.7 v v in 5.5 v, v (enx ) = v in or v (enx) = 0 v -40 c t j 125 c (2) 1 a enable input en v ih high-level input voltage 2.7 v v in 5.5 v 2.0 v v il low-level input voltage 2.7 v v in 5.5 v 0.8 v i i input current -0.5 0.5 a t on turn-on time c l = 100 f, r l = 5 3ms t off turn-off time c l = 100 f, r l = 5 10 current limit i os short-circuit output current (per channel) v (in) = 2.7 v to 5.5 v, out connected to gnd, device enable into short-circuit 1.1 1.5 1.9 a i oc_trip overcurrent trip threshold (per channel) v (in) = 5 v, current ramp ( 100 a/s) on out 1.0 1.6 2.0 a supply current supply current, low-level output no load on out, 2.7 v v in 5.5 v, v (enx ) = v in or v (enx) = 0 v t j = 25c 0.5 1 a -40 c t j 125 c (2) 0.5 5 supply current, high-level output no load on out, v (enx ) = 0 v or v (enx) = v in t j = 25 c 65 81 a -40 c t j 125 c (2) 65 90 reverse leakage current v (outx) = 5.5 v, in = ground 0.2 a
AOZ1341 rev. 1.1 june 2011 www.aosmd.com page 4 of 16 note: 2. parameters are guaranteed by design only and not production tested. 3. pulse testing techniques maintain juncti on temperature close to ambient temperature; thermal effects must be taken into acco unt separately. undervoltage lockout low-level voltage, in 2.0 2.5 v hysteresis, in 200 mv overcurrent oc1 and oc2 output low voltage v ol(ocx) i o(ocx) = 5 ma 0.4 v off-state current v o(ocx) = 5 v or 3.3 v 1 a oc_l deglitch ocx assertion or deassertion 4 8 15 ms thermal shutdown thermal shutdown threshold 135 c recovery from thermal shutdown 105 c hysteresis 30 c electrical characteristics (continued) t a = 25 c, v in = 5.5 v, v en = 0 v, unless otherwise specified. symbol parameter conditions (3) min. typ. max. units
AOZ1341 rev. 1.1 june 2011 www.aosmd.com page 5 of 16 functional block diagram deglitch deglitch oc1 en1/en1 in en2/en2 oc2 out1 out2 thermal shutdown thermal shutdown current limit gate driver enable 1 enable 2 gate driver AOZ1341 current limit
AOZ1341 rev. 1.1 june 2011 www.aosmd.com page 6 of 16 functional characteristics figure 1. turn-off delay and fall time with 1 f load (active low) figure 2. turn-on delay and rise time with 1 f load (active low) figure 3. turn-off delay and fall time with 100 f load (active low) figure 4. turn-on delay and rise time with 100 f load (active low) figure 5. short-circuit current, device enable to short figure 6. 0.6 load connected to vout en 5v/div vout 2v/div en 5v/div vout 2v/div en 5v/div iout 1a/div oc 2v/div iout 500ma/div en 5v/div vout 2v/div en 5v/div vout 2v/div 200 s/div 200 s/div 500 s/div 500 s/div
AOZ1341 rev. 1.1 june 2011 www.aosmd.com page 7 of 16 functional characteristics (continued) typical characteristics figure 7. inrush current with different load capacitance figure 8. short circuit current limit en 2v/div en 2v/div iout 500ma/div 1ms/div 20ms/div iout 500ma/div 100f 470f 220f figure 9. supply current, output enabled vs. junction temperature 80 70 60 50 40 30 20 10 0 junction temperature ( c) supply current ( a) vin=2.7v vin=3.3v vin=5v vin=5.5v figure 10. supply current, output disabled vs. junction temperature 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 junction temperature (c) supply current ( a) figure 11. rds(on) vs. ambient temperature 160 140 120 100 80 60 40 20 0 ambient temperature (c) vin=2.7v vin=3.3v vin=5v vin=5.5v figure 12. uvlo threshold vs. junction temperature 2.10 2.12 2.14 2.16 2.18 2.2 2.22 2.24 2.26 2.28 2.30 junction temperature (c) threshold (v) rising falling -50 0 50 100 150 -50 0 50 100 150 -50 0 50 100 150 -40 -20 0 20 40 60 80 vin=2.7v vin=3.3v vin=5v vin=5.5v rdson (m)
AOZ1341 rev. 1.1 june 2011 www.aosmd.com page 8 of 16 typical characteristics (continued) figure 13. ocp trip current vs. input voltage 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 vin (v) ocp trip current (a) 2 345 6 figure 14. turn on time vs input voltage 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 input voltage (v) turn on time (ms) 2 345 6 c l = 100 f r l = 5 t a = 25c figure 15. turn off time vs input voltage 2.0 1.9 1.8 1.7 1.6 1.5 input voltage (v) turn off time (ms) 23456 c l = 100 f r l = 5 t a = 25c figure 17. fall time vs input voltage 0.6 0.5 0.4 0.3 0.2 0.1 0 input voltage (v) fall time (ms) 2 345 6 c l = 100 f r l = 5 t a = 25c figure 16. rise time vs input voltage 0.6 0.5 0.4 0.3 0.2 0.1 0 input voltage (v) rise time (ms) 2 345 6 c l = 100 f r l = 5 t a = 25c
AOZ1341 rev. 1.1 june 2011 www.aosmd.com page 9 of 16 detailed description the AOZ1341 is a member of alpha and omega semiconductor?s dual channel power distribution switch family intended for applications where heavy capacitive loads and short-circuits are li kely to be encountered. this device incorporates 70 m n-channel mosfet power switches for power-distribution systems that require multiple power switches in a single package. each switch is controlled by a logic enable input. gate drive is provided by an internal charge pump designed to control the power-switch rise and fa ll times to minimize current surges during switching. the charge pump requires no external components and allows operation from supplies as low as 2.7 v. power switch the power switch is a n-channel mosfet with a low on-state resistance capable of delivering 1 a of continuous current. configured as a high-side switch, the mosfet will go into high impedance when disabled. thus, preventing current flow from out to in and in to out. charge pump an internal charge pump supplies power to the circuits and provides the necessary voltage to drive the gate of the mosfet beyond the source. the charge pump is capable of operating down to a low voltage of 2.7 volts. driver the driver controls the voltage on the gate to the power mosfet switch. this is used to limit the large current surges when the switch is being turned on and off. proprietary circuitry controls the rise and fall time of the output voltages. enable the logic enable disables the power switch, charge pump, gate driver, logic device, and other circuitry to reduce the supply current. when the enable receives a logic high the supply current is reduced to approximately 1 a. the enable input is compatible with both ttl and cmos logic levels. over-current the over-current open drain output is asserted (active low) when an over-current condition occurs. the output will remain asserted until the over-current condition is removed. a 15 ms deglitch circuit prevents the over-current from false triggering. thermal shut-down protection when the output load exceeds the current-limit threshold the device limits the output current to a safe level by switching into a constant -current mode, pulling the overcurrent (oc) logic output low. during current limit conditions the increasing power dissipation in the chip causing the die temperature to rise. when the die temperature reaches a specified level the thermal shutdown circuitr y will shutdown the device. the thermal shutdown will cycl e repeatedly until the short circuit condition is resolved.
AOZ1341 rev. 1.1 june 2011 www.aosmd.com page 10 of 16 applications information input capacitor selection the input capacitor prevents large voltage transients from appearing at the input, and provides the instantaneous current needed each time the switch turns on and also to limit inpu t voltage drop. the input capacitor t also prevents high-frequency noise on the power line from passing through the output of the power side. the choice of the input capacitor is based on its ripple current and voltage ratings rather than its capacitor value. the input capacitor should be located as close to the vin pin as possible. a 0.1 f ceramic cap is recommended but higher capa citor values will further reduce the voltage drop at the input. output capacitor selection the output capacitor acts in a similar way. a small 0.1 f capacitor prevents high-frequency noise from going into the system. also, the output capacitor has to supply enough current for a large load that it may encounter during system transients. this bulk capacitor must be large enough to supply fast transient load in order to prevent the output voltage from dropping. power dissipatio n calculation calculate the power dissipation for normal load condition using the following equation: p d = r on x (i out ) 2 the worst case power dissipation occurs when the load current hits the current limit due to over-current or short circuit faults. the power dissipation under these conditions can be calculated using the following equation: p d = (v in ? v out ) x i limit layout guidelines proper pcb layout is important for improving the thermal and overall performance of the AOZ1341. to optimize the switch response time to out put short-circuit conditions keep all traces as short as po ssible to reduce the effect of unwanted parasitic inductance. place the input and output bypass capacitors as close as possible to the in and out pins. the input and output pcb traces should be as wide as possible for the given pcb space. use a ground plane to enhance the power dissipation capability of the device.
AOZ1341 rev. 1.1 june 2011 www.aosmd.com page 11 of 16 usb power distribut ion application figure 18. typical four-port usb host/self-powered hub applications circuitry AOZ1341 in d+ vbus d- out1 out2 gnd power supply cx 0.1 f cx 22 f 0.1 f 10k 10k gnd usb controller d+ vbus d- cx 0.1 f cx 22 f gnd d+ vbus d- cx 0.1 f cx 22 f gnd d+ vbus d- cx 0.1 f cx 22 f gnd oc1 en2/en2 oc2 en1/en1
AOZ1341 rev. 1.1 june 2011 www.aosmd.com page 12 of 16 package dimensions, so-8 notes: 1. all dimensions are in millimeters. 2. dimensions are inclusive of plating 3. package body sizes exclude mold flash and gate burrs. mold flash at the non-lead sides should be less than 6 mils. 4. dimension l is measured in gauge plane. 5. controlling dimension is millimeter, converted inch dimensions are not necessarily exact. symbols a a1 a2 b c d e e e1 h l dimensions in millimeters recommended land pattern min. 1.35 0.10 1.25 0.31 0.17 4.80 3.80 5.80 0.25 0.40 0 d c l h x 45 7 (4x) b 2.20 2.87 5.74 0.80 0.635 unit: mm 1.27 a1 a2 a 0.1 gauge plane seating plane 0.25 e 8 1 e e1 nom. 1.65 1.50 4.90 3.90 1.27 bsc 6.00 max. 1.75 0.25 1.65 0.51 0.25 5.00 4.00 6.20 0.50 1.27 8 symbols a a1 a2 b c d e e e1 h l dimensions in inches min. 0.053 0.004 0.049 0.012 0.007 0.189 0.150 0.228 0.010 0.016 0 nom. 0.065 0.059 0.193 0.154 0.050 bsc 0.236 max. 0.069 0.010 0.065 0.020 0.010 0.197 0.157 0.244 0.020 0.050 8
AOZ1341 rev. 1.1 june 2011 www.aosmd.com page 13 of 16 tape and reel dimensions, so-8 carrier tape reel tape size 12mm reel size ?330 m ?330.00 0.50 package so-8 (12mm) a0 6.40 0.10 b0 5.20 0.10 k0 2.10 0.10 d0 1.60 0.10 d1 1.50 0.10 e 12.00 0.10 e1 1.75 0.10 e2 5.50 0.10 p0 8.00 0.10 p1 4.00 0.10 p2 2.00 0.10 t 0.25 0.10 n ?97.00 0.10 k0 unit: mm b0 g m w1 s k h n w v r trailer tape 300mm min. or 75 empty pockets components tape orientation in pocket leader tape 500mm min. or 125 empty pockets a0 p1 p2 feeding direction p0 e2 e1 e d0 t d1 w 13.00 0.30 w1 17.40 1.00 h ?13.00 +0.50/-0.20 k 10.60 s 2.00 0.50 g r v leader/trailer and orientation unit: mm
AOZ1341 rev. 1.1 june 2011 www.aosmd.com page 14 of 16 package dimensions, exposed pad msop-8 gauge plane seating plane notes: 1. all dimensions are in millimeters. 2. dimensions are inclusive of plating. 3. package body sizes exclude mold flash and gate burrs. mold flash at the non-lead sides should be less than 6 mils each. 4. dimension l is measured in gauge plane. 5. controlling dimension is millimeter, converted inch dimensions are not necessarily exact. symbols a a1 a2 b c d d1 e e e1 e2 l l1 l2 1 2 dimensions in millimeters min. 0.81 0.05 0.76 0.25 0.13 2.90 1.55 2.90 4.70 1.3 0.40 0.90 0 nom. 1.02 0.86 0.30 0.15 3.00 0.65 typ. 3.00 4.90 0.55 0.95 0.25 bsc 12 max. 1.12 0.15 0.97 0.40 0.23 3.10 1.8 3.10 5.10 1.8 0.70 1.00 6 recommended land pattern d e e1 a a2 e b a1 0.10mm l2 l l1 c 1 0.75 4.35 0.65 0.35 2 e2 d1 1.9 1.9 symbols a a1 a2 b c d d1 e e e1 e2 l l1 l2 1 2 dimensions in inches min. 0.032 0.002 0.030 0.010 0.005 0.116 0.06 0.116 0.185 0.05 0.016 0.035 0 nom. 0.040 0.034 0.012 0.006 0.118 0.026 typ. 0.118 0.192 0.022 0.037 0.010 bsc 12 max. 0.044 0.006 0.038 0.016 0.010 0.120 0.07 0.120 0.20 0.07 0.028 0.039 6
AOZ1341 rev. 1.1 june 2011 www.aosmd.com page 15 of 16 tape and reel dimensi ons, exposed pad mso8-p carrier tape reel tape size 12mm reel size ?330 m ?330.00 0.50 package msop-8 t 0.30 0.05 b0 3.30 0.10 a0 5.20 0.10 k1 1.20 0.10 k0 1.60 0.10 d0 ?1.50 +0.1/-0.0 e 12.0 0.3 e1 1.75 0.10 e2 5.50 0.05 p0 8.00 0.10 p1 4.00 0.05 n ?97.00 0.10 unit: mm g m w1 s k h n w v r trailer tape 300mm min. components tape orientation in pocket leader tape 500mm min. k1 w 13.00 0.30 w1 17.40 1.00 h ?13.00 +0.50/-0.20 k 10.60 s 2.00 0.50 g r v leader/trailer and orientation unit: mm t r0.3 max b0 p2 p1 k0 k1 a0 p0 section b-b' section b-b' 4.2 3.4 r0.3 typ. d0 d1 e e2 e1 d1 ?1.50 min. p2 2.00 0.05 notes: 1. 10 sprocket hole pich cumulative tolerance 0.2. 2. camber not to exceed 1mm in 100mm. 3. a0 and b0 measured on a plane 0.3mm above the bottom of the pocket. 4. k0 measured from a plane on the inside bottom of the pocket to the top surface of the carrier. 5. pocket position relative to sprocket hole measured as tue position of pocket, not pocket hole. 6. all dimensions in mm. feeding direction
AOZ1341 rev. 1.1 june 2011 www.aosmd.com page 16 of 16 part marking z1341ai fay part number code assembly lot code year & week code wlt fab code & assembly location code AOZ1341ai (so-8) 1341ei fayw lt part number code assembly lot code year & week code fab code & assembly location code AOZ1341ei (exposed pad msop-8) z1341ai1 fay part number code assembly lot code year & week code wlt fab code & assembly location code AOZ1341ai-1 (so-8) 1341ei fayw lt 1 part number code assembly lot code year & week code fab code & assembly location code AOZ1341ei-1 (exposed pad msop-8) as used herein: 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. a critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. this datasheet contains preliminary data; supplementary data may be published at a later date. alpha & omega semiconductor reserves the right to make changes at any time without notice. life support policy alpha & omega semiconductor products ar e not authorized for use as critical components in life support devices or systems.

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